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Porosity copper layer perspective Illustration and Icon
Porosity copper layer perspective
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A stylized isometric rendering shows a porous copper (Cu) layer with polygonal voids dispersed across the top surface and through the side walls, representing pores within a metallic thin film. In materials science and metallurgy, such microstructure increases surface area and permeability for applications in catalysis, electrodes, and thermal interfaces. The entity illustrated is a material microstructure at the surface of a layered copper substrate, depicting pores within a film-level hierarchy.
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